TacFlux Fuzan 02-GF is a flux-gel for manual soldering and rework, rated for reflow at temperatures up to 260 °C and compatible with all SAC alloys and most SnPb alloys used in electronics assembly. Typical properties include a Brookfield viscosity of roughly 9.0 Pa·s (cone-plate, 10 rpm), an acid number of 120.6 mg KOH/g, and a tack strength of 250 g, giving reliable component hold during rework and repair operations. It can be reflowed in air or nitrogen, and its residues (about 69.5% by weight remaining after reflow) tested satisfactory for surface insulation resistance and electrochemical migration per J-STD-004A (IPC-TM-650), meaning no post-solder cleaning is required under standard use — though Clarix C01, B02, P03, or U05 cleaning fluids can remove residue if desired. Syringes should be stored applicator-down and given roughly 4 hours to reach room temperature before use; shelf life is 12 months at 0–30 °C.