Introduction of electron beam evaporation coater:

The equipment uses electron beam evaporation as coating equipment. It is mainly used to prepare various conductive thin films, semiconductor thin films, ferroelectric thin films, optical thin films, micro-fabrication of micro and nano devices, sample pretreatment of electron microscopy, etc. It is especially suitable for evaporating various refractory metal materials. It can be used not only on hard substrates such as glass and silicon wafers, but also on flexible substrates such as PDMS, PTFE and PI.



Technical parameters of electron beam evaporation coater:

Conditions of use

ambient temperature 5 ~40 C

Power supply

three-phase 380 V

Power

<20 KW

Water pressure

<2.5bar

Vacuum chamber size

evaporation chamber size: Phi 500 *H500

Electronic gun

a new type of electronic gun, 6-hole crucible

Sample turntable

Sample size: <150mm, sample can be rotated, and the distance between sample and electron gun can be adjusted up and down (Sample holder shape is designed according to user's requirements), heating temperature <500 C.

System Vacuum

Limit vacuum: baked for 12 to 24 hours, continuously pumped less than 5x10-5Pa

Pumping Rate: Vacuum < 5x10-4Pa within 40 minutes from atmospheric start

System Leakage Rate: Measuring Vacuum Vacuum Degree of Vacuum Chamber < 10Pa after 12 hours of shutdown



Vacuum pumping system

FB1200 molecular pump + mechanical pump (TRP-36) system with bypass pumping



Coating monitoring

SQM160 film thickness meter is used for monitoring.

Coating thickness

The unevenness of coating thickness is less than 6%