Fuzan B1 is a lead-free solder paste currently being brought to market by Ostec-Integra as part of a new automated industrial production line dedicated to solder paste manufacturing, with launch planned for the first half of 2026. As the newest addition to the Fuzan paste family alongside the leaded Fuzan H1 and dispensing-grade Fuzan 1-D, it is being developed to extend the range into fully lead-free SMT assembly, supporting customers migrating away from tin-lead processes. Detailed alloy composition, reflow profile, and packaging specifications will be published closer to the commercial launch; in the meantime, Fuzan B1 can be positioned in export materials as a "coming soon" addition to the Fuzan solder paste portfolio produced in Russia. Note: this entry is based solely on Ostec-Integra's own announcement of the new production line; no product datasheet is yet published, so no specific chemistry, alloy, or process parameters should be claimed until the official launch.