0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting

Product Description Super Hard Tools of Hi Precision Metal Sintered Diamond Dicing Blade To abrasive or cut Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc Diamond wheel shape and indicates: D -- Out Diameter H -- Inner Diameter W-- Thickness 0.1mm Diamond...
Product Description
Super Hard Tools of Hi Precision Metal Sintered Diamond Dicing Blade



To abrasive or cut Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc





Diamond wheel shape and indicates:



D -- Out Diameter

H -- Inner Diameter

W-- Thickness





0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting 0





W (mm)


D (mm)



H (mm)


0.1-1.0



50-120



32, 40, 52, 70







Over 15 years of developing and producing experience in high precision super hard material tools, we have

established a high efficiency system to provide stable performance wheel products.



We welcome yr free inquiry for any question in our diamond cutting wheels. In order to supply exact wheel

type and quotatioon to you, if possible, better for you to provide us more information like followings:



1. Yr processing objects.

2. Yr OD, ID, Thickness data.

3. Grit size if possible.

4. Rotary speed of your processing machine.



Many Thanks.

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